1976

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OST 108.895.102-76
OST 108.895.102-76
Eccentric clamps. Design and dimensions.
OST 108.895.103-76
OST 108.895.103-76
Double-acting lever clamps. Design and dimensions.
OST 11-000.029-76
OST 11-000.029-76
Electronic products. Operational documents.
OST 11-010.014-76
OST 11-010.014-76
Normal linear dimensions.
OST 11-021.002-76
OST 11-021.002-76
Tungsten wire for electronics. General specifications.
OST 11-021.003-76
OST 11-021.003-76
Wolframium and molybdenum alloy wire for electronics. General specifications. General specifications.
OST 11-021.004-76
OST 11-021.004-76
Molybdenum wire for electronics. General specifications.
OST 11-021.005-76
OST 11-021.005-76
Wolframium and molybdenum alloy wire for electronics. General specifications. General specifications.
OST 11-021.006-76
OST 11-021.006-76
High-melting metal and alloy wire for electronics. Control methods.
OST 11-022.007-76
OST 11-022.007-76
Copper cast microwires in glass insulation. Specifications.
OST 11-027.014-76
OST 11-027.014-76
Electric vacuum glass. Determination of nickel oxide
OST 11-027.015-76
OST 11-027.015-76
Electric vacuum glass. Determination of nickel oxide and cobalt oxide using spectrophotometric method
OST 11-027.016-76
OST 11-027.016-76
Electron-tube glass. The sum of aluminium oxide, iron oxide and titanium oxide.
OST 11-027.017-76
OST 11-027.017-76
Electron-tube glass. Determination of iron oxide content.
OST 11-027.023-76
OST 11-027.023-76
Glassceramic cement. Analysis methods of chemical composition.
OST 11-028.007-76
OST 11-028.007-76
Polymeric organic materials. Determination of moisture permeability and sorption properties.
OST 11-054.165-76
OST 11-054.165-76
Integrated circuits for MOSFETs. Manufacturing technology. General technical requirements.
OST 11-054.166-76
OST 11-054.166-76
Integrated circuits for MOSFETs. Chemical treatment of plates. Operating procedure.
OST 11-054.167-76
OST 11-054.167-76
Integrated circuits for MOSFETs. Plates oxidation Operating procedure.
OST 11-054.168-76
OST 11-054.168-76
Integrated circuits for MOSFETs. Photolithography. Operating procedure.

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